freetoplayandearnnftgames| The concept of glass substrates has become a new hot spot, and many companies quickly respond to relevant questions

Securities Times e Company NewsfreetoplayandearnnftgamesOn Friday, the concept of A-share glass substrates rose, with many stocks trading at 20% daily limit. On the interactive platform, a large number of investors asked listed companies about relevant issues, and many companies quickly responded to relevant questions.① Lehman Optoelectronics: The innovative solution of PM driving structure + glass substrate developed and launched by the company in cooperation with upstream partners has broken through key core technical problems such as massive via technology, thick copper technology, and via copper filling technology, and solved the problem of glass substrates. The shortcomings of easy fragmentation and difficult subsequent maintenance are not only conducive to reducing costs while meeting the display effect. It is a new breakthrough in the field of Micro LED size ultra-high-definition display technology. At present, the company is actively exploring to further optimize and improve the core technical level of chip transfer, bonding, packaging, and maintenance of PM-driven glass-based Micro LED display products.② Dazu CNC: The company adopts new ultra-fast picosecond laser, high-precision motion control and other technologies, and develops ultra-fast laser drilling equipment, which can realize ultra-fast drilling of through holes in the field of advanced packaging of glass substrates.③ Xingsen Technology: The company has launched a glass substrate research and development project and is advancing it in an orderly manner. However, the company's products are raw materials for chip packaging and do not involve the packaging field.④ Longli Technology: The company currently reserves Mini-LED, Micro-LED and other related technologies that can use a variety of substrates, including glass substrates, and has corresponding invention patents. In the future, the company will continue to innovate and further enhance the company's competitive strength., enhance the company's overall value.③ Dier Laser has also replied to investors before: The company's TGV laser micro-hole equipment uses precision control systems and laser modification technology to realize micro-hole and micro-groove processing on glass substrates of different materials, which is used for subsequent metallization processes. Provide conditions for realization and can be applied to glass substrate packaging and other related fields. At present, the company has achieved small batch orders.④ Vogel Optoelectronics has previously replied to investors: From the perspective of product and technology application prospects, based on the company's glass-based metallization and copper through-hole technology (TGV technology) and glass-based carrier board circuit design and development capabilities, the company's glass substrates can be used in CPO2freetoplayandearnnftgamesThe company also continues to pay attention to this field for the vertical packaging carrier interposer for 5D/3D packaging and the packaging substrate below that realizes the interconnection of optical modules and chips.