kingpinarcade| Leybold High-Tech: The new glass packaging carrier board product co-developed by the company involves TGV technology

Gelonghui May 26| some investors askedkingpinarcade, does the company involve TGV technology? Leybold High-Tech stated on the interactive platform that the new glass packaging carrier board products jointly developed by the company involve TGV technology, but TGV technology is currently facing problems such as insufficient technology maturity and high technical thresholds. There is certain uncertainty whether it can successfully achieve breakthroughs. Please treat it objectively and rationally.